HDI板产品信息
所有层为交错与堆叠式铜填充激光通孔
每面高达14层，6层为高密度互连积层
无卤素基材料 (中等至高等TG)=
镀边技术，保护空间优化与组装
技术数据单
|
Capabilities |
Standard Production |
Advanced Production |
|---|---|---|
|
Layer Count / Technology |
4 - 12 Layers |
4 - 14 Layers |
|
PCB Thickness Range |
0,3- 1,2 mm |
0,3 - 1,4 mm |
|
Build up Technology |
ANY LAYER Microvias copper filled |
ANY LAYER Microvias copper filled |
|
Min. Laser drill Diameter |
110 µm |
80 µm |
|
Laser Technology |
CO2 direct drilling (UV/CO2) |
CO2 direct drilling (UV/CO2) |
|
Materials |
FR4 / FR4 halogen reduced |
FR4 / FR4 halogen reduced |
|
Glass Transition Temperature |
105°C / 140°C / 170°C |
105°C / 140°C / 170°C |
|
Standard glass cloth |
106 / 1080 / 2116 / 1501 / 7628 |
1037 / 106 / 1080 / 2116 / 1501 / 7628 |
|
Copper thickness |
12 µm / 18µm |
9µm / 12µm / 18µm |
|
Copper Plating Holes |
20 µm (25 µm) |
13 µm / 20 µm / 25 µm |
|
Min. Line / Spacing |
75µm / 75µm |
50µm / 50µm |
|
Soldermask Registration |
+/- 38 µm (Photoimageable) |
+/- 25 µm (Photoimageable) |
|
Min. Soldermask Dam |
70 µm |
60 µm |
|
Soldermask Color |
green / white / black / red / blue |
green / white / black / red / blue |
|
Max. PCB Size |
575 mm x 500 mm |
575 mm x 500 mm |
|
Production Panel |
609,6 mm x 530 mm |
609,6 mm x 530 mm |
|
Min. Annular Ring |
125 µm |
100 µm |
|
smallest drill |
0,28 mm |
0,15 mm |
|
smalles Routing bit |
0,8 mm |
0,8 mm |
|
Surfaces |
OSP / HAL Lead Free / Immersion Tin |
OSP / HAL Lead Free / Immersion Tin |
|
Scoring |
Yes |
Yes |
|
ID print |
White |
White |
|
Blue Mask & Carbon print |
Yes |
Yes |
通讯手机HDI
通讯手机HDI
通讯模块HDI
5G模块PCB