深联电路板

13年专注HDI研发制造行业科技创新领跑者

全国咨询热线: 4000-169-679 订单查询我要投诉

热门关键词: HDI板厂家 POS机HDI HDI生产厂家 汽车HDI线路板 显示屏HDI HDI PCB

当前位置:首页» 深联动态 » Invitation | Sun&Lynn Circuits in NEPCON JAPAN 2019!

Invitation | Sun&Lynn Circuits in NEPCON JAPAN 2019!

文章来源:作者:静静 查看手机网址
扫一扫!
扫一扫!
人气:1998发布日期:2018-12-04 05:05【

The 48th NEPCON JAPAN will be from 16-18th Jan 2019. NEPCON JAPAN is the world’s largest exhibition for electronic manufacturing equipment and microelectronics industry. Most of the leading companies will be showcasing their cutting-edge technologies in the exhibition every year.

Being one of the tier one PCB manufacturing solution providers, Sun&Lynn Circuits will be introducing her brand new PCB technologies and products for the dedicated market sectors like telecommunication, medical & healthcare, automotive, industrial & instrumental.

Visit Sun&Lynn at Booth E35-18, Hall 4

16-18th Jan, 2019.

Big Sight, Tokyo, Japan

Brief introduction of NEPCON JAPAN

Started in 1972, NEPCON JAPAN has been growing up together with electronics industry in Japan and the majority of Asian countries. Consisting of 7 shows, the Nepcon Japan is specialized in electronics R&D, manufacturing and packaging technology and has been representing the new trend for the emerging applications such as automobiles, wearable devices, AI, and IoTs.

Do NOT miss out your annual grand show in Nepcon Japan!

And this year, in Nepcon Japan 2019, we Sun&Lynn will be waiting for you .

我要评论:  
内容:
(内容最多500个汉字,1000个字符)
验证码:
 
此文关键字:

最新产品

通讯手机HDI
通讯手机HDI

型号:GHS08K03479A0
阶数:8层二阶
板材:EM825
板厚:0.8mm
尺寸:144.08mm*101mm
最小线宽:0.075mm
最小线距:0.075mm
最小孔径:0.1mm
表面处理:沉金+OSP

通讯手机HDI
通讯手机HDI

型号:GHS06C03294A0
阶数:6层二阶
板材:EM825
板厚:1.0mm
尺寸:92mm*118mm
最小线宽:0.075mm
最小线距:0.075mm
最小孔径:0.1mm
表面处理:沉金

通讯模块HDI
通讯模块HDI

型号:GHS04K03404A0
阶数:4层一阶+半孔
板材:EM825
板厚:0.6mm
尺寸:94.00*59.59mm
最小线宽:0.076mm
最小线距:0.076mm
最小孔径:0.1mm
表面处理:沉金+OSP

通讯背板PCB
通讯背板PCB

型号:S16P27767A0
层数:16层
板材:生益S1000-H
板厚:4.0+/-0.4mm
尺寸:430mm*462mm
最小孔径:0.7mm
最小线宽:0.203mm
最小孔铜:25um
表面处理:沉锡

P1.5显示屏HDI
P1.5显示屏HDI

型号:GHS04C03605A0
层数:4层一阶
所用板材:EM825
板厚:1.6mm
尺寸:24mm*116mm
最小盲孔:0.1mm
最小埋孔:0.2mm
最小线宽:0.13mm
最小线距:0.097mm
表面处理:沉金
外形公差:+0.05/-0.15mm(板内无定位孔)
特殊要求:灯窝

间距:P1.5

P2.571显示屏HDI
P2.571显示屏HDI

型号:GHS04C03429A0
阶层:4层一阶
板材:EM825 
板厚:1.6mm
尺寸:215.85mm*287.85mm
最小盲孔:0.1mm
最小埋孔:0.2mm
最小线宽:0.152mm
最小线距:0.152mm
表面处理:沉金
外形公差:+/-0.15mm(板内无定位孔)
特殊要求:控深钻帽子电镀

间距:P2.571

P1.9显示屏HDI
P1.9显示屏HDI

型号:GHM08C03113A0
阶层:8层一阶
板材:EM825
板厚:1.6mm
尺寸:239.9mm*239.9mm
最小盲孔:0.1mm
最小埋孔:0.2mm
最小线宽:0.127mm
最小线距:0.127mm
表面处理:沉金
外形公差:+0.05/-0.15mm(板内无定位孔)
特殊要求:控深钻

间距:P1.9

P1.923显示屏HDI
P1.923显示屏HDI

型号:GHM06C03444A0
阶层:6层二阶
板材:EM825 
板厚:2.0mm
尺寸:199.85mm*299.85mm
最小盲孔:0.1mm
最小埋孔:0.2mm
最小线宽:0.127mm
最小线距:0.127mm
表面处理:沉金
外形公差:+0.15/-0.05mm(板内无定位孔)
特殊要求:控深钻

间距:P1.923

同类文章排行

最新资讯文章

您的浏览历史